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Dyfenco International Co., Ltd.

PN436

Product Name :
PN436
High throughput SMT process solution

Deposition  Test Pattern: QFP Pad (fine pitch)


Stencil Thickness  :
 130 microns
Stencil Material  :
 Stainless Steel
Printer   :
 DEK  ELAi
Printing Speed  :
 60 mm/s
Stencil Separation  Speed  : 0.3 mm/s
Stencil Separation  Speed  :
 40N
Atmosphere  :
 25℃, 50%HR

Demonstrations of stencil aperture clogging

paste_pn436_2.jpg
 paste_pn436_3.jpg
PN436 No obvious clogging between QFP lead frame after 20 prints.

After 20 prints, the surface of QFP lead frame is observed to be uneven, causing noticeable clogging.



Printing-ability Analysis QFN (pitch 0.4mm)

Excellent Deposition
 Poor Deposition
paste_pn436_4.jpg
 paste_pn436_5.jpg
PN436
 Conversational


Good Soldering Performance for 0201 Chip

Consistent Soldering Performance After 12 HRs Printing 

Still perfect soldering performance 
 Solder powder Oxidation
paste_pn436_6.jpg
 paste_pn436_7.jpg
PN436
 Conversational





In the process of SMT printing, the stencil needs cleaning every 4 or 5 prints. With usage of  PN436  lead free solder paste, the cleaning frequency is substantially lowered, saving lots of time and costs of stencil cleaning, which in turn helps improve productivity.
 
PN436 lead free solder paste carries out perfect printing performance with excellent deposition, stable viscosity after continuous printing for 8 hours and full and complete printing shape without clogging.

Related Prodcuts From This Supplier

AR Series Adhesive

2799

HF961

NAP100®

Solder Preform

Contact us

Company Name :Dyfenco International Co., Ltd.
Contact Person :Mr. David
Address :No. 136, Silin Rd., Yanchao Dist.
City :Kaohsiung City
Country :Taiwan Taiwan
Website :https://www.dyfenco.com/
Telephone :886-7-6160317
Fax :886-7-6161639