Chip capacitor introduction:
1. Thin layers in ceramic dielectric and multilayer technology provide large capacitance.
2. Full monolithic structure provides high mechanical intensity.
3. Simple metal-ceramic monolithic construction provides high stability and reliability over a wide temperature range.
Features:
1. Nickel barrier end terminations to improve solderability.
2. Multilayer block structure provides higher reliability.
3. A wide range of capacitance values available in standard case sizes.
Applications:
General electronic devices.
1. Cap. range (µF): (1) Standard type: 6.3V~50V. (2) NPO: 100V~630V. (3) NPO: 1KV~3KV. (4) X7R: 100V~630V. (5) X7R: 1KV~3KV. (6) EIA symbol: NPO, X7R, X5RM Y5U, Y5V, Z5U. 2. Size and voltage. range VDC (VAC). 3. Chip Size: 0402, 0603, 0805, 1206, 1210, 1808, 1812, 2220. 4. Capacitance: 2pF to 100uF. 5. Tolerance: J (±5%); K(±10%); M(±20%); Z(+80%/-20%). 6. Rated voltage: 6.3V to 6K VDC.
Taiwan
