1. Application: Suitable for array dipping in MLCC, MLCI, MLV, LTCC, LICC, etc.
2. Features: Array Thin Carrier Plate (ATCP). The main material is stainless steel and silicon. Light and thin, cooling fast, high capacity, low cost, no pollution, high quality, and the best dipping process.
3. Advantages:
a. Diamond shaped ATCP is with good holding force, and is located precisely. It is no need for correction.
b. Dipping capacity can reach 60K pcs / hour (max.)
c. Dipping depth can be set up.
d. With Blotting and left-right side displacement function.
e. Can doctor blade one time and dipping many times.
f. No pollution and conform to any quality management regulation.
g. Can prevent from air bubble on dipping surface.
(1) Chip: above 0204 sizes
(2) Thin Array Carrier Plate (ATCP) :
* 0204 ---3220 holes / pc
* 0306--- 1736 holes / pc
* 0408--- 1288 holes / pc
* 0508--- 1024 holes / pc
* 0610--- 719 holes / pc
* 0612--- 615 holes / pc
* above 0612 size made on request
* ATCP size: 152mmx152mm
(3) Ink Tray:
* 242mm(L)x202mm(W)x15.6mm(T)
* Groove size made on request
(4) Size of ink tank: 154mm(L)x124mm(W)x20mm(H)
(5) Vacuum pressure: 0~500 mmHg
(6) Air pressure: 5 kg/cm2
(7) Power: 200(380)VAC, 3 phase, 50/60 Hz
(8) Measurement: 1200(L)x1000(W)x2050(H) (include alarm light)
(9) Weight: 800 Kgs
Taiwan
