This new packaging solution, PoP (Package on Package), helps designers save space on digital camera design boards and shorten the interconnection distance between electric components, significantly improving performance. The integrated SiP structure also shortens the development cycle and helps camera system manufacturers improve time-to-market.
Slim digital camera models are popular with consumers and continue to gain market share. This new packaging technology will help camera manufacturers bring new compact models to market more quickly and more cost effectively.
-MCP: NAND Flash 1Gb (x8) + DDR2 SDRAM 1Gb (x16)
-DSP: Zoran COACH 12
-Power supply: NAND(3.3V); DRAM(1.8V)
-Outline: 15x15x0.9(mm)
Taiwan
